2025 OCP APAC Summit

2025 OCP APAC Summit

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9:00am PDT

Cooling Environments Overview

9:10am PDT

Super Fluid Technology Application in High Density Server Product

9:25am PDT

Superfluid Technology: Redefining AI Cooling with Air-Infused Dielectric Fluids

9:40am PDT

Empowering Data Centers with Synthetic Ester Coolants: A New Era of Efficiency, Safety, and Sustainability

9:55am PDT

Chip to Data Thermal Resistance to Support 30°C Coolant

10:10am PDT

Intel Super Fluid Technology Application in High Density Server Product

10:45am PDT

Advanced Liquid Cooling Solutions

11:00am PDT

Energy Efficiency in Datacenter

11:15am PDT

Exhausted Heat Reuse by Free Cooling in IDC

11:30am PDT

Waste Heat Recovery and Reuse Opportunities

11:45am PDT

Embracing AI: Infrastructure and Advanced Thermal Solutions

1:00pm PDT

UQDv2 - Enabling Liquid at Scale

1:15pm PDT

Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach

1:30pm PDT

Enabling Scalable, Energy-Efficient Cooling with Two-Phase Sidecar Solutions

1:45pm PDT

The Cooling Solution for the Next Era: Advancements in Pumped Two-Phase Solutions

1:45pm PDT

The Evolution of Direct Liquid Cooling — From Single-phase to Two-phase

2:15pm PDT

CDU

2:45pm PDT

Overview of safety requirements for liquid cooling technologies

3:00pm PDT

Data Center Commissioning and Considerations for Direct Liquid Cooled Solutions

3:15pm PDT

Corrosion Behavior of Brazed Heterogeneous Materials in Liquid Cooling Systems

3:30pm PDT

Making the case for AI factories as a profit center

3:45pm PDT

Predicting immersion fluid's stability window through accelerated aging model

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